Patents

• KR 10-2024-0058410, H. E. Lee, J. H. Joe, I. Doh, S. Y. Park, “Biosignal measurement device containing conductive hydrogel nanocomposite material” 

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• KR 10-2024-0038593, H. E. Lee, S. Y. Park, “Stress colorimetric sensor and its manufacturing method” 

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• KR 10-2023-0193471, H. E. Lee, J. H. Kim, W. H. Park, “High heat dissipation porous patch and manufacturing method, plant growth monitoring system using the same” 

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• KR 10-2023-0098503, H. E. Lee, J. H. Joe, I. Doh, J. H. Kim, “Bio-signal measurement wearable patch and bio-signal measurement wearable patch generation method” ​

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• KR 10-2023-0060079, H. E. Lee, “Method of transferring electronic device based on aggregation of metal thin film layer” 

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• KR 10-2303912, K. J. Lee, H. E. Lee, T. J. Kim, J. H. Shin, S. H. Park, “Micro vacuum module for semiconductor device transfer and method for transferring semiconductor device using the micro vacuum module” 

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• US 11/295,972, K. J. Lee, H. E. Lee, T. J. Kim, J. H. Shin, S. H. Park,“Layout structure between substrate, micro-led array and micro-vacuum module for micro-led array transfer using micro-vacuum module, and method for manufacturing micro-led display using the same”

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• KR 10-2224058, K. J. Lee, D. H. Kim, H. E. Lee, “Method for fabricating flexible electronic device through physical separation using phase change of thin film” 

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• KR 10-2046982, K. J. Lee, H. E. Lee, J. H. Shin, C.-S. Shin, J. H. Choi, “Ultra-thin transparent flexible vertical micro light emitting diode and manufacturing the same” 

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• KR 10-2095215, K. J. Lee, H. E. Lee, J. H. Shin, S. H. Lee, J. H. Lee, “Active-matrix RGB vertical microLED display using transfer member and selective-transferring method” 

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• US 10/290,785, K. J. Lee, H. E. Lee, D. H. Kim, J. H. Shin, S. K. Hong, “Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device”

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• KR 10-2009492, K. J. Lee, H. E. Lee, D. H. Kim, J. H. Shin, S. K. Hong, “Transferring and packaging apparatus for fabricating the electronic device”

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• US Patent App. 16/225,178, K. J. Lee, H. E. Lee, T. J. Kim, J. H. Shin, S. H. Park, “Micro-vacuum module for Semiconductor Device Transfer and Method for Transferring Semiconductor Device Using the Micro-Vacuum Module”

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• KR 10-2224058, K. J. Lee, D. H. Kim, H. E. Lee, “Physical lift-off technique by thin-film phase transition, and method for flexible electronic devices using physical lift-off”

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• KR 10-2017-0062349, K. J. Lee, H. E. Lee, D. H. Kim, J. H. Shin, S. K. Hong, “Laminating structure of electronic device using transferring element and method for fabricating the electronic device” 

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• PCT/KR2016/010907, KR 10-1718652, K. J. Lee, S. H. Lee, H. E. Lee, “Transfer-free flexible vertical light emitting diode and manufacturing method therefor”

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• KR 10-1629468, K. J. Lee, D. Y. Park, H. E. Lee, J. K. Choi, “Wearable thin-film electronic device and method for manufacturing the Same”